Preparation and Characterization of Copper Powders with Sn Coating by the Electroless Plating

In this work, Sn-Cu composite powders were produced using an electroless process. The tin content on the surface of copper powders was varied by using different concentrations of SnSO₄ in the plating bath. The surface morphology of the produced Sn-Cu composite powders was characterized using scanning electron microscopy (SEM). Energy dispersive spectroscopy (EDS) was used to determine the elemental surface composition of the composites. X-ray diffraction (XRD) analysis was performed to investigate the structure of the Sn-Cu composite powders. The electrochemical performance of Sn-Cu nanocomposites was studied by charge/discharge tests.