Comparison between thermal simulation results generated by PLECS software and laboratory measurements

This article deals with the subject of simulation of power losses and thermal processes occurring in semiconductors, as illustrated by an example of a DC/DC buck converter. The simulations were performed in PLECS software. The results obtained from the program were compared with measurement results of a laboratory converter model. The physical model is based on the same components as assumed in the simulation. Similarly, the parameters of the transistor control signal were the same. During operation of the converter, the temperature changes were analyzed using a K-type thermocouple. Based on the obtained results of the temperature measurement in the steady state of the converter operation, the correctness of the simulation carried out in the PLECS program was verified and confirmed.